Highlights & Specs
- Rigid & rigid-flexible PCBAs
- Low – Medium volume Surface Mount Technology (SMT), Through-hole & Mixed Technology production in USA
- Medium – High volume SMT, Through-hole & Mixed Technology production in the Philippines
- uBGA, CSP, QFN, NVME BGA (0.4mm)
- Typical sizes, thicknesses & layer to include FR4, PTFE (Teflon), Al clad and Flex substrates
- X-Ray technology
- Flying Probe
- Inline AOI
- 3D SPI
- Device package sizes from 01/005 to 2 inches square
- Operators certified to IPC-A-610 and J-STD-001
- Additive Manufacturing (3D Printing)
- RoHS Compliant
- Conformal Coat Capabilities
