DFM/DFX isn’t a checklist—it’s a risk-reduction strategy. ICTC reviews your design for fab, assembly, and test readiness, then delivers prioritized findings and actionable recommendations to help reduce re-spins, rework, and debug time. Get to a buildable, testable design sooner.
Dye & Pull Testing is a destructive analysis method used to reveal hidden cracks and weak interfaces in solder joints—especially under area-array packages like BGAs, CSPs, and LGAs. By pulling the component after dye penetration, microscopic cracks and lifted pads become visible, providing objective evidence of where solder joints may be vulnerable.
Flying probe testing is a fixtureless electrical test method that uses movable probes to contact pads, vias, and component leads on your PCB instead of a dedicated bed-of-nails fixture. Under software control, the system exercises the board and measures continuity, component values, and selected power-on conditions at many points across the assembly. This provides high-value test coverage on prototypes and low- to medium-volume builds without the cost and lead time of traditional in-circuit test (ICT) fixtures.
Microsectioning—also known as cross-sectioning, is a destructive analytical method used to reveal the internal structure and quality of printed circuit boards, connectors and cable/harness terminations. By cutting, mounting, polishing and examining small cross-section samples under the microscope, hidden defects, material conditions and dimensional features become visible for objective evaluation.
Salt Fog Environmental Exposure Testing is an accelerated corrosion test used to evaluate the durability and effectiveness of coatings, finishes, materials, and electronic assemblies when exposed to salt-laden environments.
