Targeted Reliability Insight
Dye & Pull Testing helps engineering teams move beyond “pass/fail” assumptions by documenting where solder joint weaknesses are occurring and how they may relate to materials, design features, or process conditions. This insight can support failure analysis, qualification builds, NPI, line transfers, and other situations where solder joint integrity needs to be better understood.
Dye Pull Testing
Dye & Pull Testing is a destructive analysis method used to reveal hidden cracks and weak interfaces in solder joints—especially under area-array packages like BGAs, CSPs, and LGAs. By pulling the component after dye penetration, microscopic cracks and lifted pads become visible, providing objective evidence of where solder joints may be vulnerable.
Clear Documentation for Next Steps
ICTC provides photo-documented findings, mapped indications, traceability details, and recommendations aligned to the agreed test plan and customer requirements. These results help teams communicate findings clearly, prioritize corrective actions, and determine whether additional analysis, process adjustments, or design changes may be needed.
