Internal Quality Verification
ICTC’s Microsectioning services provide visual evidence and dimensional measurements to help evaluate critical internal features such as plated-through holes, vias, microvias, solder joints, crimps, insulation support, and connector interfaces. This analysis can support supplier qualification, process validation, design reviews, and investigations where internal structure and workmanship need to be confirmed.
Microsectioning / Cross-Section Analysis
Microsectioning — also known as cross-sectioning, is a destructive analytical method used to reveal the internal structure and quality of printed circuit boards, connectors and cable/harness terminations. By cutting, mounting, polishing and examining small cross-section samples under the microscope, hidden defects, material conditions and dimensional features become visible for objective evaluation.
Actionable Analysis for Reliability and Failure Review
Our reports include prepared and polished cross-sections, high-resolution microscope images, annotations, measurements, traceability details, and engineering observations tied to the agreed scope or customer requirements. These findings help teams better understand defects, compare process or material changes, support root-cause analysis, and determine appropriate next steps such as supplier feedback, design updates, or additional testing.
